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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9847237 B1

PDFFull Text
Date of Patent:
Dec. 19, 2017

Filed:

Feb. 24, 2015

Method and apparatus for manufacturing semiconductor module

Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi, JP;

Inventors:

Youichiro Baba, Miyoshi, JP;

Takayasu Hikida, Nagoya, JP;

Assignee:

TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;

Attorney:

Oliff PLC

Primary Examiner:

Jeffrey M Wollschlager

Int. Cl.
CPC ...
B29C 45/02 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); B29C 45/14 (2006.01); H01L 21/66 (2006.01); B29C 33/42 (2006.01); B29C 33/00 (2006.01); B29C 45/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 45/02 (2013.01); B29C 45/14262 (2013.01); H01L 21/67126 (2013.01); H01L 24/36 (2013.01); H01L 24/40 (2013.01); B29C 33/0022 (2013.01); B29C 33/0038 (2013.01); B29C 45/0046 (2013.01); B29C 2033/0094 (2013.01); B29C 2033/422 (2013.01); B29C 2045/0049 (2013.01); H01L 22/10 (2013.01); H01L 23/3107 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01);
Abstract

Disclosed is a technique capable of preventing an encapsulating material from covering a heat-dissipating surface of a semiconductor module, which releases heat of a switching element. Specifically disclosed a step for manufacturing a semiconductor module including a submodule having a collector and an emitter with heat-dissipating surfaces, including a step for placing the submodule in the cavity so that the submodule is pressed by the pressing device while covering the heat-dissipating surface of the emitter with the pressing device and covering the heat-dissipating surface of the collector with the lower mold, and a step for feeding the encapsulating material to the cavity by moving the piston so that the pressure of the cavity measured by the pressure measuring device does not exceed the pressure at which the pressing device presses the submodule.

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