The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 19, 2017
Filed:
Feb. 26, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Carsten von Koblinski, Bodensdorf, AT;
Ulrike Fastner, Villach, AT;
Andre Brockmeier, Villach, AT;
Peter Zorn, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/52 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/051 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 21/52 (2013.01); H01L 21/4803 (2013.01); H01L 21/683 (2013.01); H01L 21/78 (2013.01); H01L 23/051 (2013.01); H01L 23/492 (2013.01); H01L 23/49861 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 23/3677 (2013.01); H01L 2224/2101 (2013.01); H01L 2224/214 (2013.01); H01L 2224/215 (2013.01); H01L 2224/221 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29188 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/32111 (2013.01); H01L 2224/32155 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82105 (2013.01); H01L 2224/82947 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A carrier substrate having a plurality of receptacles each for receiving and carrying a semiconductor chip is provided. Semiconductor chips are arranged in the receptacles, and metal is plated in the receptacles to form a metal structure on and in contact with the semiconductor chips. The carrier substrate is cut to form separate semiconductor devices.