The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Jan. 16, 2015
Applicants:

Yu Zhu, Copley, OH (US);

Tianda He, Cuyahoga Falls, OH (US);

Inventors:

Yu Zhu, Copley, OH (US);

Tianda He, Cuyahoga Falls, OH (US);

Assignee:

The University of Akron, Akron, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); H01J 37/32 (2006.01); C23F 1/02 (2006.01); G03F 7/00 (2006.01); G06F 3/041 (2006.01); H01L 51/00 (2006.01); C23C 14/18 (2006.01); C23C 14/20 (2006.01); C23C 14/58 (2006.01); C23C 16/44 (2006.01); C23C 18/31 (2006.01); C25D 3/38 (2006.01); C25D 5/48 (2006.01); C25D 5/50 (2006.01); C25D 5/54 (2006.01); G03F 7/42 (2006.01); H01L 21/3213 (2006.01); H01L 51/44 (2006.01); G02F 1/1343 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32009 (2013.01); C23C 14/185 (2013.01); C23C 14/205 (2013.01); C23C 14/584 (2013.01); C23C 14/5806 (2013.01); C23C 14/5826 (2013.01); C23C 14/5873 (2013.01); C23C 16/44 (2013.01); C23C 18/31 (2013.01); C23F 1/00 (2013.01); C23F 1/02 (2013.01); C25D 3/38 (2013.01); C25D 5/48 (2013.01); C25D 5/50 (2013.01); C25D 5/54 (2013.01); G03F 7/0002 (2013.01); G06F 3/041 (2013.01); H01L 51/0023 (2013.01); G02F 1/13439 (2013.01); G03F 7/00 (2013.01); G03F 7/42 (2013.01); G03F 7/427 (2013.01); H01J 2237/334 (2013.01); H01L 21/32134 (2013.01); H01L 21/32139 (2013.01); H01L 51/442 (2013.01);
Abstract

A method for making a conductive film includes the steps of: depositing a conductive metal film on a substrate to form a metal-coated substrate; depositing a fiber pattern on the conductive metal film of the metal-coated substrate to form a masked substrate, the fiber pattern defining protected metal and exposed metal of the conductive metal film; removing the exposed metal from the conductive metal film of the masked substrate to form a protected conductive film; and removing the fiber pattern from the protected conductive film to expose the protected metal and provide a metal pattern on the substrate. An annealing step con be employed after depositing the fiber pattern to increase the surface area of contact between the fiber pattern and the conductive metal film.


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