The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Oct. 11, 2011
Applicants:

Alona Goldstein, Jerusalem, IL;

Irina Daynov, Givat Zeev, IL;

Herzl Ovadia, Givat Zeev, IL;

Elinor O'neill, Mevaseret Zion, IL;

Michael Dakhyia, Or Yehdua, IL;

Evgeny Glickman, Jerusalem, IL;

Inventors:

Alona Goldstein, Jerusalem, IL;

Irina Daynov, Givat Zeev, IL;

Herzl Ovadia, Givat Zeev, IL;

Elinor O'Neill, Mevaseret Zion, IL;

Michael Dakhyia, Or Yehdua, IL;

Evgeny Glickman, Jerusalem, IL;

Assignee:

AVX Corporation, Fountain Inn, SC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 85/48 (2006.01); H01H 85/041 (2006.01); H01H 85/06 (2006.01);
U.S. Cl.
CPC ...
H01H 85/0411 (2013.01); H01H 85/06 (2013.01); H01H 2085/0414 (2013.01);
Abstract

A multi layer fuse device includes a substrate and an elongated fuse element, having a pair of contact pads formed therewith at opposed longitudinal ends thereof formed on one surface of the substrate. A pair of passivation layers are provided covering the fuse and contact pads. Windows may be opened through both passivation layers above both of the contact pads, and conductive electrode material is electroplated through the windows to contact the contact pads and to extend partially above a top surface of the passivation layers. Exposed electroplated material may be coated with solderable conductive material or a surface mount termination may be provided. Electroplated material may cover a portion of the fuse surface prior to application of the passivation layers and extend to an end of the substrate so that windows are not required.


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