The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Oct. 22, 2015
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Hye Seong Kim, Suwon-Si, KR;

Eun Sang Na, Suwon-Si, KR;

Jin Sung Kim, Suwon-Si, KR;

Ok Nam Kim, Suwon-Si, KR;

Tae Hyeok Kim, Suwon-Si, KR;

Jin Man Jung, Suwon-Si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/232 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01);
Abstract

An embedded device includes a multilayer body including dielectric layers and internal electrode layers interposed between adjacent dielectric layers; external electrodes disposed on external surfaces of the multilayer body to apply electric charges having different polarities to adjacent internal electrode layers, the external electrodes containing a conductive material; first copper layers disposed on external surfaces of the external electrodes to cover the external electrodes; and second copper layers disposed on the first copper layers to cover the first copper layers. An average particle diameter of powder particles of the first copper layers is greater than an average particle diameter of powder particles of the second copper layers.


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