The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Apr. 23, 2013
Applicant:

E+e Elektronik Ges.m.b.h, Engerwitzdorf, AT;

Inventors:

Elmar Mayer, Nuβdorf, DE;

Georg Niessner, Katsdorf, AT;

Joachim Runck, Linz, AT;

Assignee:

E+E ELEKTRONIK GES.M.B.H, Engerwitzdorf, AT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 27/22 (2006.01); H01L 27/04 (2006.01);
U.S. Cl.
CPC ...
G01N 27/223 (2013.01); G01N 27/225 (2013.01); G01N 27/228 (2013.01); H01L 27/04 (2013.01);
Abstract

A moisture sensor arrangement including a plate-like semiconductor substrate and an integrated signal processing component disposed on a first side of the semiconductor substrate. The moisture sensor arrangement including a capacitive moisture sensor connected electrically conductively to the integrated signal processing component, wherein the capacitive moisture sensor is disposed on either the first side or a second side of the semiconductor substrate that is opposite the first side of the semiconductor substrate. In addition, the plate-like semiconductor substrate includes 1) plated through-holes, by way of which elements on the first side and the second side of the semiconductor substrate are electrically connectable to one another; and 2) a temperature sensor integrated with the integrated signal processing component.


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