The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

May. 12, 2014
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Jan U. Wieneke, Dusseldorf, DE;

Frank Kuester, Dusseldorf, DE;

Zhong Chen, Woodbury, MN (US);

Jingjing Ma, Cottage Grove, MN (US);

Kerstin Unverhau, Neuss, DE;

Doreen Eckhardt, Dormagen, DE;

Claudia Torre, Dusseldorf, DE;

Jonathan E. Janoski, Woodbury, MN (US);

Jayshree Seth, Woodbury, MN (US);

Arlin L. Weikel, Mansfield, PA (US);

Assignee:

3M INNOVATIVE PROPERTIES COMPANY, Saint Paul, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/02 (2006.01); C09J 133/08 (2006.01); B05D 3/06 (2006.01); B05D 7/04 (2006.01); B05D 7/14 (2006.01); B05D 7/00 (2006.01); B32B 37/26 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0217 (2013.01); B05D 3/067 (2013.01); B05D 7/04 (2013.01); B05D 7/14 (2013.01); B05D 7/5423 (2013.01); B32B 37/26 (2013.01); C09J 133/08 (2013.01); B32B 2037/268 (2013.01); B32B 2333/12 (2013.01); C08L 2312/00 (2013.01); C09J 2201/36 (2013.01); C09J 2205/31 (2013.01);
Abstract

The present disclosure relates to a multilayer pressure sensitive adhesive assembly comprising at least a first pressure sensitive adhesive layer superimposed to a second polymer layer, wherein a curable liquid precursor of the first pressure sensitive adhesive polymer layer comprises a low Tg (meth)acrylate copolymer and a high Tg (meth)acrylate copolymer having a weight average molecular weight (Mw) of above 20,000 Daltons. The present disclosure also relates to a method of manufacturing such a pressure sensitive adhesive assembly and uses thereof.


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