The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Apr. 14, 2014
Applicant:
Nitto Denko Corporation, Osaka, JP;
Inventors:
Takashi Habu, Osaka, JP;
Hirofumi Ebe, Osaka, JP;
Assignee:
NITTO DENKO CORPORATION, Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0058 (2013.01); H05K 1/165 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/086 (2013.01); H05K 2203/068 (2013.01); H05K 2203/085 (2013.01);
Abstract
A method for producing a soft magnetic film laminate circuit board having a soft magnetic film laminated on at least one side of a circuit board includes the steps of bringing a soft magnetic thermosetting film containing soft magnetic particles, having a porosity of 15% or more and 60% or less, and in a semi-cured state into contact with the one side of the circuit board and bringing the soft magnetic thermosetting film into a cured state by vacuum hot pressing.