The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Jul. 15, 2011
IN Hee Cho, Seoul, KR;
Yun Ho an, Seoul, KR;
Eun Jin Kim, Seoul, KR;
Hae Yeon Kim, Seoul, KR;
Jae Man Park, Seoul, KR;
Hyun Gyu Park, Seoul, KR;
Hyuk Soo Lee, Seoul, KR;
In Hee Cho, Seoul, KR;
Yun Ho An, Seoul, KR;
Eun Jin Kim, Seoul, KR;
Hae Yeon Kim, Seoul, KR;
Jae Man Park, Seoul, KR;
Hyun Gyu Park, Seoul, KR;
Hyuk Soo Lee, Seoul, KR;
LG INNOTEK CO., LTD., Seoul, KR;
Abstract
Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.