The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Dec. 01, 2014
Applicant:

General Electric Company, Schenectady, NY (US);

Inventor:

Robert Joseph Roessler, Wylie, TX (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/00 (2006.01); H05K 3/24 (2006.01); C25D 5/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); C25D 5/022 (2013.01); H05K 1/0263 (2013.01); H05K 1/0265 (2013.01); H05K 3/0091 (2013.01); H05K 3/06 (2013.01); H05K 3/243 (2013.01); H05K 2201/09336 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09736 (2013.01);
Abstract

A multilayer printed circuit board is provided. The multilayer printed circuit board includes a core, a first conductive layer coupled to the core, an insulating layer covering the first conductive layer, and a second conductive layer spaced from the first conductive layer by the insulating layer. The first conductive layer includes a first portion having a first thickness and a second portion having a second thickness greater than the first thickness. The second conductive layer is electrically coupled to the second portion of the first conductive layer by a conductive via extending through the insulating layer.


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