The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Oct. 03, 2016
Applicant:

Uniflex Technology Inc., Taichung, TW;

Inventors:

Yi-Chun Liu, New Taipei, TW;

Chiu-Pei Huang, Taichung, TW;

Pei-Hao Hung, Taichung, TW;

Yuan-Chih Lee, Taoyuan, TW;

Assignee:

UNIFLEX Technology Inc., Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0278 (2013.01); H05K 1/115 (2013.01); H05K 3/064 (2013.01); H05K 3/421 (2013.01); H05K 3/423 (2013.01); H05K 3/429 (2013.01); H05K 3/4652 (2013.01); H05K 3/4664 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09545 (2013.01); H05K 2203/0502 (2013.01);
Abstract

A rigid-flex circuit board includes a flexible circuit board, a plurality of patterned photo-imageable substrates and a plurality of patterned circuit layers. The flexible circuit board includes a plurality of exposed regions, a top surface and a bottom surface opposite to the top surface. The exposed regions are respectively located at the top surface and the bottom surface. The patterned photo-imageable substrates are disposed on the top surface and the bottom surface respectively. Each patterned photo-imageable substrate includes an opening exposing the corresponding exposed region. Each patterned photo-imageable substrate includes photo-sensitive material. The patterned circuit layers are disposed on the patterned photo-imageable substrates respectively and expose the exposed regions. A manufacturing method of the rigid-flex circuit board is also provided.


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