The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Nov. 22, 2011
Applicants:

Wolfgang Pahl, München, DE;

Jürgen Portmann, München, DE;

Inventors:

Wolfgang Pahl, München, DE;

Jürgen Portmann, München, DE;

Assignee:

SnapTrack, Inc., San Diego, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/22 (2006.01); H01L 23/10 (2006.01); H01L 23/04 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/49811 (2013.01); H01L 23/552 (2013.01); H05K 3/22 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/1461 (2013.01);
Abstract

The invention relates to a cased electrical component comprising a carrier substrate (), a spring device (), which is arranged on the carrier substrate (), a chip (), which on a first side () of the chip is coupled to the spring device (), and a cover element (), which is arranged on the carrier substrate (). The cover element () is arranged over the chip () such that the cover element () is in contact with the chip () at least on a second side () of the chip, which is different from the first side. The component has a low space requirement and is highly sealed with respect to influences from the surroundings.


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