The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Sep. 24, 2015
Applicant:

Kyocera Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Seiichirou Itou, Kyoto, JP;

Tetsuya Tojo, Kyoto, JP;

Takeshi Oyamada, Kyoto, JP;

Yoshitada Konishi, Kyoto, JP;

Naoki Horinouchi, Kyoto, JP;

Assignee:

KYOCERA Corporation, Kyoto-shi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/62 (2013.01);
Abstract

There is provided an electronic component mounting substrate which excels in resistance to migration, and is thus capable of maintaining high thermal conductivity and insulation performance for a long period of time. An electronic component mounting substrate includes: a metallic substrate formed of aluminum or an aluminum-based alloy; an alumite layer disposed on the metallic substrate, having a network of crevices at an upper surface thereof; and a ceramic layer disposed on the alumite layer, part of the ceramic layer extending into the crevices.


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