The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Jun. 16, 2017
Applicant:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Inventors:
Hyuck Jung Choi, Ansan-si, KR;
Dae Hee Kim, Ansan-si, KR;
Assignee:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H05B 33/10 (2006.01); H01L 21/66 (2006.01); H01L 33/56 (2010.01); H01L 33/50 (2010.01); H05B 33/12 (2006.01);
U.S. Cl.
CPC ...
H01L 33/005 (2013.01); H01L 22/12 (2013.01); H01L 33/504 (2013.01); H01L 33/56 (2013.01); H05B 33/10 (2013.01); H05B 33/12 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01);
Abstract
A method of fabricating a light-emitting device including the steps of forming a first resin including a phosphor on a light-emitting diode chip mounted on a package body, measuring color coordinates of light emitted by combination of the light-emitting diode chip and the phosphor, correcting the color coordinates by forming a second resin on the first resin, and curing the first resin and the second resin after correcting the color coordinates, in which the first resin is not fully cured before measuring and correcting the color coordinates.