The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

H01L 27/11 (2006.01); H01L 27/24 (2006.01); H01L 27/11507 (2017.01); H01L 27/22 (2006.01); H01L 29/423 (2006.01); H01L 21/265 (2006.01); H01L 21/28 (2006.01); H01L 21/02 (2006.01); H01L 29/49 (2006.01);

U.S. Cl.

CPC ...

H01L 27/2436 (2013.01); H01L 21/02164 (2013.01); H01L 21/26513 (2013.01); H01L 21/28088 (2013.01); H01L 21/28176 (2013.01); H01L 27/11507 (2013.01); H01L 27/228 (2013.01); H01L 29/4236 (2013.01); H01L 29/4966 (2013.01);

Abstract

A method for fabricating an electronic device that includes a metal-insulator-semiconductor (M-I-S) structure includes: providing a semiconductor layer; forming a primary insulation layer of a first thickness over the semiconductor layer; forming a reactive metal layer of a second thickness over the primary insulation layer, where the second thickness is greater than the first thickness; forming a primary capping layer of a third thickness over the reactive metal layer, where the third thickness is greater than the second thickness; and performing a thermal treatment.

Find Patent Forward Citations

Kim, Chi-Ho. (2017). Electronic device including metal-insulator-semiconductor structure and method for fabricating the same (U.S. Patent No. 9842881). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9842881

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