The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Apr. 28, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui, CN;

Inventors:

Junlin Peng, Beijing, CN;

Shuai Yuan, Beijing, CN;

Ming Huang, Beijing, CN;

Lilu Zhao, Beijing, CN;

Feng Xu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/308 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1288 (2013.01); H01L 21/3085 (2013.01); H01L 27/124 (2013.01); H01L 29/41733 (2013.01);
Abstract

The present disclosure provides an array substrate and a method of manufacturing the same, and a display panel comprising the array substrate, for reducing a drop or height difference between surfaces of portions of a passivation layer located on either side of a source/drain electrode lead wire and a surface of a portion of passivation layer located on an upper surface of the source/drain electrode lead wire so as to increase an aperture ratio of the display panel. The method comprises: forming a source/drain electrode lead wire and a passivation layer successively on a base substrate, the passivation layer at least covering the source/drain electrode lead wire; and thinning a portion of the passivation layer located on the source/drain electrode lead wire such that a surface of the portion is higher than those of other portions of the passivation layer, at the time of patterning the passivation layer to form a via hole therein.


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