The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Apr. 22, 2016
Applicant:
Hrl Laboratories, Llc, Malibu, CA (US);
Inventors:
Florian G. Herrault, Agoura Hills, CA (US);
Miroslav Micovic, Thousand Oaks, CA (US);
Assignee:
HRL Laboratories, LLC, Malibu, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/053 (2006.01); H01L 23/08 (2006.01); H01L 21/78 (2006.01); H01L 21/321 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/32115 (2013.01); H01L 21/4817 (2013.01); H01L 21/4846 (2013.01); H01L 21/4871 (2013.01); H01L 21/78 (2013.01); H01L 23/053 (2013.01); H01L 23/08 (2013.01); H01L 23/3675 (2013.01); H01L 23/3736 (2013.01); H01L 23/49838 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6683 (2013.01);
Abstract
There is provided an integrated RF subsystem including a chip substrate, a circuit patterned on a first surface of the chip substrate, a probe electrically integrated with the circuit on a first side of the chip substrate, a frame at a second side of the chip substrate defining a first cavity underneath the circuit.