The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Oct. 16, 2015
Applicant:
Samsung Electronics Co., Ltd, Suwon-Si, Gyeonggi-do, KR;
Inventor:
Eon Soo Jang, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/367 (2013.01); H01L 25/105 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01);
Abstract
A semiconductor package includes a lower package with a lower substrate and a lower semiconductor chip. A heat dissipation part is provided adjacent to a side of the lower package and covers a portion of the lower semiconductor chip, and an upper package is on the lower package and is laterally spaced apart from the heat dissipation part.