The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9842786 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 12, 2017

Filed:

Sep. 11, 2015
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventor:

Yuji Iizuka, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/40 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/16 (2013.01); H01L 23/3121 (2013.01); H01L 23/3675 (2013.01); H01L 23/4006 (2013.01); H01L 23/49838 (2013.01); H01L 24/13 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 23/3735 (2013.01); H01L 23/49833 (2013.01); H01L 23/49844 (2013.01); H01L 24/16 (2013.01); H01L 2023/4056 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/48 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A semiconductor device includes a supporting plate including a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface; and a semiconductor unit fixed to the first surface. The semiconductor unit includes an insulating plate, a circuit plate fixed to a front surface of the insulating plate, a semiconductor chip fixed to the circuit plate, and a protruding metal block fixed to a rear surface of the insulating plate and penetrating through the through hole to extend to the second surface.


Find Patent Forward Citations

Iizuka, Yuji. (2017). Semiconductor device (U.S. Patent No. 9842786). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9842786

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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