The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Aug. 25, 2015
Applicant:

Seagate Technology Llc, Cupertino, CA (US);

Inventors:

Steven A. Mastain, Spring Park, MN (US);

Terry A. Jacobson, Coon Rapids, MN (US);

Assignee:

SEAGATE TECHNOLOGY LLC, Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/362 (2014.01); B23K 26/00 (2014.01); B23K 26/06 (2014.01); B23K 26/03 (2006.01); H01L 21/268 (2006.01); H01L 21/302 (2006.01); H01L 21/20 (2006.01); B23K 26/0622 (2014.01); H01L 23/544 (2006.01); B23K 26/361 (2014.01); H01L 21/66 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/302 (2013.01); B23K 26/0006 (2013.01); B23K 26/032 (2013.01); B23K 26/0622 (2015.10); B23K 26/361 (2015.10); H01L 23/544 (2013.01); B23K 2203/56 (2015.10); H01L 22/20 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2924/0002 (2013.01);
Abstract

When opaque films are deposited on semi-conductor wafers, underlying features may be concealed. In accordance with one implementation, such concealed features may be re-exposed via an ablation recovery process. One ablation recovery process entails aligning an energy source with a target position on a first surface of a semiconductor wafer based on position information retrieved from a second opposite surface of the semiconductor wafer, and firing a beam of the energy source to ablate opaque material at the target position and to expose a recovery feature underlying the opaque material.


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