The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Mar. 24, 2014
Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Ji Young Hwang, Daejeon, KR;

Dong Hyun Oh, Daejeon, KR;

Hang Suk Choi, Daejeon, KR;

Seung Heon Lee, Daejeon, KR;

Sungjoon Min, Daejeon, KR;

Assignee:

LG CHEM, LTD., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06F 1/16 (2006.01); G02F 1/1333 (2006.01); G06F 3/044 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01); G06F 3/147 (2006.01); H05K 3/00 (2006.01); H05K 3/16 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); G06F 1/1643 (2013.01); H05K 1/0296 (2013.01); H05K 1/0313 (2013.01); H05K 3/10 (2013.01); G06F 1/1652 (2013.01); G06F 3/147 (2013.01); G06F 2203/04103 (2013.01); H05K 3/0014 (2013.01); H05K 3/16 (2013.01); H05K 2201/0326 (2013.01); H05K 2203/0108 (2013.01);
Abstract

The present application provides a conductive pattern laminate including: a substrate having concave portions or protrusion portions on an upper surface thereof; and a conductive film provided on an upper surface of concave portions or protrusion portions of the substrate and on a portion in which no concave portions or protrusion portions are present on the upper surface of the substrate, in which the conductive film provided on the upper surface of concave portions or protrusion portions of the substrate and the conductive film provided on the portion in which no concave portions or protrusion portions are present on the upper surface of the substrate are electrically disconnected from each other, a method for manufacturing the same, and an electronic apparatus including the laminate.


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