The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Apr. 26, 2016
Applicant:

Samsung Display Co., Ltd., Yongin-si, Gyeonggi-Do, KR;

Inventors:

Hoon Kang, Suwon-si, KR;

Bum Soo Kam, Yongin-si, KR;

Se Yoon Oh, Yongin-si, KR;

Chong Sup Chang, Hwaseong-si, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); C23F 1/00 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); G03F 7/00 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); H01L 31/18 (2006.01); H01L 29/41 (2006.01); H01L 51/44 (2006.01); C23F 1/02 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0007 (2013.01); C23F 1/02 (2013.01); G03F 7/2002 (2013.01); G03F 7/32 (2013.01); H01L 21/32134 (2013.01); H01L 29/413 (2013.01); H01L 31/1884 (2013.01); H01L 31/1888 (2013.01); H01L 51/442 (2013.01);
Abstract

A method for manufacturing a display device includes forming a plurality of light blocking patterns on a first surface of a transparent substrate, wherein a first light blocking pattern of the plurality of light blocking patterns has a different line width than a second light blocking pattern of the plurality of light blocking patterns. An insulating layer is formed on the first surface of the transparent substrate and the light blocking patterns. A conductive layer is formed on the insulating layer. A photo-resist layer is formed on the conductive layer. The photo-resist layer is exposed with ultraviolet rays through a second surface of the transparent substrate, wherein the first and second surfaces of the transparent substrate are opposite to each other. The photo-resist layer is developed. The conductive layer is etched using the photo-resist layer as a mask. The photo-resist layer is removed.


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