The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Jun. 28, 2016
Applicant:

Sae Magnetics (H.k.) Ltd., Hong Kong, CN;

Inventors:

Sidney Shen Kuang Chou, Hong Kong, CN;

Yiu Sing Ho, Hong Kong, CN;

Kam Fung Yip, Hong Kong, CN;

Jian Feng He, Hong Kong, CN;

Assignee:

SAE MAGNETICS (H.K.) LTD., Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 28/00 (2006.01); G02B 27/64 (2006.01); G03B 5/00 (2006.01); G02B 7/02 (2006.01); B23K 1/00 (2006.01); B23K 1/005 (2006.01);
U.S. Cl.
CPC ...
G02B 27/646 (2013.01); B23K 1/005 (2013.01); B23K 1/0016 (2013.01); G02B 7/023 (2013.01); G02B 7/025 (2013.01); G02B 7/026 (2013.01); G03B 5/00 (2013.01); G03B 2205/0076 (2013.01);
Abstract

An assembly method of a SMA assembly, includes disposing a lens holder unit on a SMA unit, the lens holder unit being provided with a first spring, a lens holder and a coil that are mounted on the first spring, with the first spring pressed against a mounting surface of the SMA unit; and bonding the first spring of the lens holder unit with the mounting surface of the SMA unit. The assembly process is simplified, the coating and soldering space become big to facilitate the bonding process, and the joining force between the SMA unit and the lens holder unit is enhanced.


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