The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2017
Filed:
Nov. 24, 2010
Takatoshi Muta, Shiga, JP;
Tomoyuki Nemoto, Shiga, JP;
Jun Takagi, Shiga, JP;
Kanako Hayashi, Shiga, JP;
Takatoshi Muta, Shiga, JP;
Tomoyuki Nemoto, Shiga, JP;
Jun Takagi, Shiga, JP;
Kanako Hayashi, Shiga, JP;
MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;
Abstract
A heat-shrinkable laminated film having: (A) layer mainly having a polyester series resin; (C) layer mainly having a polystyrene series resin or mixture of polyester series and polystyrene series resins; and (B) layer mainly having polyester series and polystyrene series resins and disposed between (A) and (C) layers, the film having excellent heat-shrinkability, transparency, and interlayer-adhesiveness at room temperature, not easily peeled in a high-temperature treatment, inhibited from whitening when bent during processing, and suitable for shrinkage-packaging, shrink-bond-packaging, etc., with (B) layer having: a hard polyester series resin or mixture of hard polyester series and soft polyester series resins; and soft styrene series resin, hard styrene series resin, or mixture thereof, or with a content of the (B) layer polyester series resin smaller than that of the (A) layer one, and a content of the (C) layer polyester series resin smaller than that of the (B) layer one.