logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9840033 B1

PDFFull Text
Date of Patent:
Dec. 12, 2017

Filed:

Jul. 28, 2015

Mold for resin injection molding

Applicant:

Matsuura Machinery Corporation, Fukui, Fukui, JP;

Inventors:

Kouichi Amaya, Fukui, JP;

Yukinori Urushizaki, Fukui, JP;

Ryuzo Tanaka, Fukui, JP;

Assignee:

Matsuura Machinery Corporation, Fukui, Fukui, JP;

Attorney:

Richard M. Goldberg

Primary Examiner:

Ryan Ochylski

Int. Cl.
CPC ...
B29C 45/17 (2006.01); B29C 45/73 (2006.01); B29C 33/38 (2006.01); B22F 3/105 (2006.01); B29L 31/00 (2006.01); B22F 5/00 (2006.01); B29C 45/72 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1703 (2013.01); B29C 33/3814 (2013.01); B29C 45/73 (2013.01); B22F 3/1055 (2013.01); B22F 5/007 (2013.01); B29C 45/7207 (2013.01); B29C 45/7312 (2013.01); B29L 2031/757 (2013.01); Y02P 10/292 (2015.11); Y02P 10/295 (2015.11);
Abstract

A mold for resin injection moldinghaving a shaping region formed by a low-density shaped portionand a high-density shaped portionin which each ventilation channelfor gas existing between an external region and a molding portion region forms a hollow state surrounded by a peripheral wall having any one or both of the high-density shaped portionand the low-density shaped portion, and the secondary ventconnecting communicatively with a region molding portion is formed only by a low-density shaped portionwith thickness thinner than that of the shaping region.

Find Patent Forward Citations

Amaya, Kouichi. (2017). Mold for resin injection molding (U.S. Patent No. 9840033). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9840033

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…