The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Aug. 19, 2015
Applicant:

Sodick Co., Ltd., Kanagawa, JP;

Inventors:

Shuji Okazaki, Kanagawa, JP;

Shuichi Kawada, Kanagawa, JP;

Katsutaka Muranaka, Kanagawa, JP;

Assignee:

Sodick Co., Ltd., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 67/00 (2017.01); B22F 3/00 (2006.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B22F 3/008 (2013.01); B29C 67/0077 (2013.01); B29C 67/0085 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12);
Abstract

A lamination molding apparatus which can improve the lamination molding accuracy, is provided. A lamination molding apparatus, including a chamber covering a desired molding region, the chamber being filled with an inert gas of a predetermined concentration; and a molding table provided in the molding region, the molding table being configured so as to be capable of being moved vertically by a driving mechanism; wherein the molding table is configured to be temperature-controllable; and a thermostatic section is provided in between the molding table and the driving mechanism or in the driving mechanism, temperature of the thermostatic section being maintained substantially constant, is provided.


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