The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Mar. 20, 2015
Applicant:

Msi Computer (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Hung Chang, New Taipei, TW;

Min-Lang Chen, New Taipei, TW;

Hsueh-Lung Cheng, New Taipei, TW;

Assignee:

MSI Computer (Shenzhen) Co., Ltd., Shenzhen, Gauangdong Province, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/00 (2006.01); H01L 23/473 (2006.01); F28D 11/02 (2006.01); F28D 15/00 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20218 (2013.01); F28D 11/02 (2013.01); F28D 15/00 (2013.01); H01L 23/00 (2013.01); H01L 23/473 (2013.01); F28D 15/0208 (2013.01); F28D 15/0266 (2013.01);
Abstract

A liquid cooling apparatus includes a heat exchange module and a cooling module. The heat exchange module includes a liquid outlet and a liquid outlet. The cooling module includes a first body, a second body, a first cooling component and a cooling duct. The first body is connected to the liquid outlet. The second body is connected to the liquid outlet, and the first body is disposed above the second body. The first cooling component is disposed between the first body and the second body. The cooling duct is connected to the first body and the second body, and the cooling duct is in thermal contact with the first cooling component.


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