The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Aug. 30, 2012
Antonius Petrus Marinus Dingemans, Tilburg, NL;
Antonius Petrus Marinus Dingemans, Tilburg, NL;
PHILIPS LIGHTING HOLDING B.V., Eindhoven, NL;
Abstract
There is provided a method for manufacturing a component interconnect board () comprising a conductor structure for providing electrical circuitry to at least one component () when mounted on the component board, the method comprising providing a conductor sheet () with a first predetermined pattern (), providing a solder resist sheet () with a second predetermined pattern for defining solder areas () of the component board, forming a subassembly () by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate (). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.