The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Aug. 15, 2012
Applicants:

Masanori Fujidai, Nagaokakyo, JP;

Isamu Fujimoto, Nagaokakyo, JP;

Inventors:

Masanori Fujidai, Nagaokakyo, JP;

Isamu Fujimoto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/00 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 24/18 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H05K 1/186 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/2518 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 3/4046 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10242 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/1469 (2013.01); Y02P 70/611 (2015.11);
Abstract

In a component-embedded substrate, a component and wiring block units are embedded in a component-embedded layer; conductive layers are located on all surfaces of the wiring block units; the component and the wiring block units are arranged such that lower surface side conductive layers of the wiring block units and electrodes of the component contact lower surface side wiring layers; via-hole conductors are located in respective upper positions relative to upper surface side conductive layers of the wiring block units and the electrodes of the component; and upper surface side wiring layers of the component-embedded layer are thus electrically connected to upper surface side conductive layers of the wiring block units, and the electrodes of the component by the via-hole conductors.


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