The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Feb. 04, 2016
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Michiya Kohiki, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 3/00 (2006.01); C25D 1/04 (2006.01); H05K 3/20 (2006.01); C25D 7/06 (2006.01); H05K 3/02 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); C25D 3/04 (2006.01); C25D 3/18 (2006.01); C25D 3/38 (2006.01); C25D 3/56 (2006.01); C25D 5/14 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C25D 1/04 (2013.01); C25D 7/0614 (2013.01); H05K 3/0058 (2013.01); H05K 3/025 (2013.01); H05K 3/205 (2013.01); H05K 3/4007 (2013.01); H05K 3/421 (2013.01); C23C 18/1653 (2013.01); C25D 3/04 (2013.01); C25D 3/18 (2013.01); C25D 3/38 (2013.01); C25D 3/562 (2013.01); C25D 5/14 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0726 (2013.01);
Abstract
Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.