The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Jan. 12, 2015
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Hongrui Cao, Guangdong, CN;

Xiaoping Tan, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1345 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01); G02F 1/13452 (2013.01); G02F 1/13458 (2013.01); H05K 1/025 (2013.01); H05K 1/028 (2013.01); H05K 1/09 (2013.01); H05K 1/117 (2013.01); H05K 1/147 (2013.01); H05K 1/0245 (2013.01); H05K 2201/05 (2013.01); H05K 2201/10136 (2013.01);
Abstract

The disclosure is related to a flexible printed circuit board. The flexible printed circuit board comprises a connecting area and a plurality of gold fingers disposed inside the connecting area, wherein the distances of the gold fingers are different. The disclosure is further related to a liquid crystal display. By the above manner, the disclosure is able to change the distances between the adjacent gold fingers to increase the number of the gold fingers without changing the size of the flexible printed circuit board so as to solve the impedance matching problem of the gold fingers of the flexible printed circuit board, and in the meanwhile to increase the assembling yield rate of the flexible printed circuit board.


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