The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Apr. 29, 2013
Applicant:

GE Intelligent Platforms Embedded Systems, Inc., Charlottesville, VA (US);

Inventors:

Graham Charles Kirk, Towcester, GB;

Zeshan Jabar Hussain, Towcester, GB;

Assignee:

Abaco Systems, Inc., Huntsville, AL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 5/00 (2006.01); H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 7/1404 (2013.01); H05K 7/20545 (2013.01);
Abstract

A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount.


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