The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Aug. 05, 2016
Electronics and Telecommunications Research Institute, Daejeon, KR;
Dong-Young Kim, Daejeon, KR;
Dong Min Kang, Daejeon, KR;
Seong-Il Kim, Daejeon, KR;
Hae Cheon Kim, Daejeon, KR;
Jae Won Do, Daejeon, KR;
Byoung-Gue Min, Sejong-si, KR;
Ho Kyun Ahn, Daejeon, KR;
Hyung Sup Yoon, Daejeon, KR;
Sang-Heung Lee, Daejeon, KR;
Jong Min Lee, Daejeon, KR;
Jong-Won Lim, Daejeon, KR;
Yoo Jin Jang, Daejeon, KR;
Hyun Wook Jung, Daejeon, KR;
Kyu Jun Cho, Daejeon, KR;
Chull Won Ju, Daejeon, KR;
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon, KR;
Abstract
Provided herein is a patch antenna including a multilayered substrate on which a plurality of dielectric layers are laminated; at least one metal pattern layer disposed between the plurality of dielectric layers outside a central area of the multilayered substrate; an antenna patch disposed on an upper surface of the multilayered substrate and within the central area; a ground layer disposed on a lower surface of the multilayered substrate; a plurality of connection via patterns penetrating the plurality of dielectric layers to connect the metal pattern layer and the ground layer, and surrounding the central area; a transmission line comprising a first transmission line unit disposed on the upper surface of the multilayered substrate and located outside the central area, and a second transmission line unit disposed on the upper surface of the multilayered substrate and located within the central area; and an impedance transformer located below the second transmission line unit within the central area of the multilayered substrate.