The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Oct. 17, 2014
Applicant:

Viking Tech Corporation, Hsinchu County, TW;

Inventors:

Chien-Hung Ho, Hsinchu County, TW;

Chiu-Min Lee, Hsinchu County, TW;

Chen-Shen Kuo, Hsinchu County, TW;

Assignee:

Vikiing Tech Corporation, Hukou Township, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 33/642 (2013.01); H01L 24/73 (2013.01); H01L 33/641 (2013.01); H05K 1/0206 (2013.01); H01L 33/647 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48237 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H05K 1/0306 (2013.01); H05K 1/113 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers.


Find Patent Forward Citations

Loading…