The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Dec. 17, 2009
Applicants:

Sivalingam Sivananthan, Naperville, IL (US);

James W. Garland, Aurora, IL (US);

Michael W. Carmody, Western Springs, IL (US);

Inventors:

Sivalingam Sivananthan, Naperville, IL (US);

James W. Garland, Aurora, IL (US);

Michael W. Carmody, Western Springs, IL (US);

Assignee:

EPIR Technologies, Inc., Bolingbrook, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/06 (2006.01); H01L 31/0296 (2006.01); H01L 31/073 (2012.01); H01L 31/18 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0296 (2013.01); H01L 31/073 (2013.01); H01L 31/1836 (2013.01); H01L 31/1892 (2013.01); H01L 21/0248 (2013.01); H01L 21/02381 (2013.01); H01L 21/02395 (2013.01); H01L 21/02469 (2013.01); H01L 21/02485 (2013.01); Y02E 10/543 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method of forming a Group II-VI multijunction semiconductor device comprises providing a Group IV substrate, forming a first subcell from a first Group II-VI semiconductor material, forming a second subcell from a second Group II-VI semiconductor material, and removing the substrate. The first subcell is formed over the substrate and has a first bandgap, while the second subcell is formed over the first subcell and has a second bandgap which is smaller than the first bandgap. Additional subcells may be formed over the second subcell with the bandgap of each subcell smaller than that of the preceding subcell and with each subcell preferably separated from the preceding subcell by a tunnel junction. Prior to the removal of the substrate, a support layer is affixed to the last-formed subcell in opposition to the substrate.


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