The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Aug. 24, 2015
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Hongwei Tian, Beijing, CN;

Kaihong Ma, Beijing, CN;

Wenqing Xu, Beijing, CN;

Yueping Zuo, Beijing, CN;

Xiaowei Xu, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 23/50 (2006.01); H01L 29/41 (2006.01); H01L 21/28 (2006.01); H01L 27/12 (2006.01); H01L 29/417 (2006.01); H01L 29/49 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42384 (2013.01); H01L 21/28008 (2013.01); H01L 23/50 (2013.01); H01L 27/124 (2013.01); H01L 29/41 (2013.01); H01L 29/41733 (2013.01); H01L 29/4908 (2013.01); H01L 29/786 (2013.01);
Abstract

A conductive structure and a manufacturing method thereof, an array substrate and a display device. The conductive structure includes a plurality of first metal layers made of aluminum, and between every two first metal layers that are adjacent, there is also provided a second metal layer, which is made of a metal other than aluminum. With the conductive structure, the hillock phenomenon that happens to the conductive structure when it is heated can be decreased without reducing the overall thickness of the conductive structure.


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