The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Nov. 07, 2016
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Michael Lesley Sorensen, Waverly, NY (US);
Sean Mathew Garner, Elmira, NY (US);
Assignee:
Corning Incorporated, Corning, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H05K 1/11 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H05K 1/115 (2013.01); H05K 1/186 (2013.01); H05K 3/10 (2013.01); H05K 3/284 (2013.01); H05K 3/30 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract
Embodiments are related to fluidic assembly and, more particularly, to systems and methods for forming physical structures on a substrate.