The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Jan. 28, 2014
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Tian San Tan, Melaka, MY;
Theng Chao Long, Melaka, MY;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01R 4/00 (2006.01); H01L 25/07 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/4334 (2013.01); H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/37 (2013.01); H01L 24/38 (2013.01); H01L 24/70 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/89 (2013.01); H01L 24/97 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01R 4/00 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05609 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/3719 (2013.01); H01L 2224/37026 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83825 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/8484 (2013.01); H01L 2224/84143 (2013.01); H01L 2224/84447 (2013.01); H01L 2224/84815 (2013.01); H01L 2224/84825 (2013.01); H01L 2224/84855 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1425 (2013.01); H01L 2924/14252 (2013.01); H01L 2924/14253 (2013.01); H01L 2924/181 (2013.01);
Abstract
A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together.