The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Oct. 05, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/70 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/60 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 24/05 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/5225 (2013.01); H01L 23/60 (2013.01); H01L 24/02 (2013.01); H01L 24/13 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/80345 (2013.01); H01L 2224/96 (2013.01); H01L 2225/06537 (2013.01); H01L 2924/3025 (2013.01); H05K 1/0218 (2013.01);
Abstract
A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.