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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9837343 B1

PDFFull Text
Date of Patent:
Dec. 05, 2017

Filed:

Jun. 29, 2015

Chip embedded substrate

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Joon Sung Kim, Suwon-Si, KR;

Yong Ho Baek, Seoul, KR;

Jung Hyun Cho, Busan, KR;

Eung Suek Lee, Anyang-si, KR;

Jae Hoon Choi, Yongin-si, KR;

Young Gwan Ko, Seoul, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Gyeonggi-Do, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 3/46 (2006.01); H01L 23/13 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/4846 (2013.01); H01L 23/5389 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H05K 3/4602 (2013.01); H01L 23/13 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/3511 (2013.01); H05K 1/185 (2013.01); H05K 3/305 (2013.01); H05K 2201/09227 (2013.01); H05K 2203/1469 (2013.01); H05K 2203/167 (2013.01);
Abstract

A chip embedded substrate includes: an insulating layer having outer layer circuit patterns provided on any one of an upper surface and a lower surface thereof; a chip embedded in the insulating layer; and internal circuit patterns included in the insulating layer and disposed between a height of a top surface of the chip and a height of a bottom surface thereof.

Find Patent Forward Citations

Kim, Joon. (2017). Chip embedded substrate (U.S. Patent No. 9837343). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9837343

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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