The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Mar. 17, 2014
Applicant:

Taiyo Yuden Co., Ltd., Taito-ku, Tokyo, JP;

Inventors:

Koji Otsuka, Takasaki, JP;

Tomoaki Nakamura, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01); H01G 4/248 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01);
Abstract

In an embodiment of a ceramic electronic component, an external electrodeof a capacitorhas one first planar part SEa of roughly rectangular profile positioned on a surface that specifies the length dimension of the ceramic chip, as well as four second planar parts SEb of roughly rectangular profile positioned on both surfaces that specify the height dimension, and both surfaces that specify the width dimension, of the ceramic chipand also continuing to the first planar part SEa. The second planar part SEb is constituted by a baked metal filmformed on the exterior surface of the ceramic chipand a plated metal filmformed on the exterior surface of the baked metal filmvia an adhesive force mitigation film


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