The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Dec. 17, 2013
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Siegfried Herrmann, Neukirchen, DE;

Walter Wegleiter, Nittendorf, DE;

Andreas Plöβl, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21S 8/10 (2006.01); H05K 3/32 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
F21S 48/1109 (2013.01); F21S 48/115 (2013.01); F21S 48/212 (2013.01); F21S 48/215 (2013.01); H01L 25/0753 (2013.01); H01L 33/0079 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H05K 3/32 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01); H05K 3/325 (2013.01); H05K 2201/1034 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/10924 (2013.01); Y10T 29/49131 (2015.01);
Abstract

An optoelectronic device and a method for producing an optoelectronic device are disclosed. An embodiment of an optoelectronic device includes a carrier, an electrically conductive layer arranged on the carrier, at least one semiconductor chip comprising an active layer for generating electromagnetic radiation, wherein the semiconductor chip is electrically conductively and mechanically connected with the carrier via the electrically conductive layer. The device further comprises a holder, wherein a surface of the carrier remote from the semiconductor chip is arranged on the holder, wherein the carrier is mechanically connected with the holder by at least one fastening element and is fastened to the holder, wherein the fastening element passes completely through the carrier, and wherein the semiconductor chip is electrically conductively connected to the holder by the fastening element.


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