The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Feb. 24, 2015
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Takumi Yutou, Ibaraki, JP;
Minoru Hanaoka, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;
Abstract
A pressure-sensitive adhesive tape that uses, as a plasticizer, an alternative compound to bis(2-ethylhexyl) phthalate (DOP) and dibutyl phthalate (DBP), having excellent tackiness, and can be unwound satisfactorily, where DOP and DBP are to be restricted under the REACH regulation. The pressure-sensitive adhesive tape includes a poly(vinyl chloride) substrate and a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer is disposed on or over one side of the substrate. The poly(vinyl chloride) substrate contains 10 to 40 percent by weight of bis(2-ethylhexyl) terephthalate. The pressure-sensitive adhesive tape preferably has an unwinding force of 0.4 N/20 mm or less at a tensile speed of 0.3 m/min and an unwinding force of 1.2 N/20 mm or less at a tensile speed of 30 m/min.