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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9834650 B1

PDFFull Text
Date of Patent:
Dec. 05, 2017

Filed:

Mar. 05, 2015

Carbon fiber bundle for resin reinforcement, and method for manufacturing carbon fiber bundle for resin reinforcement, carbon-fiber-reinforced thermoplastic resin composition, and molded body

Applicant:

Mitsubishi Rayon Co., Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Tadashi Ohtani, Toyohashi, JP;

Atsushi Takahashi, Toyohashi, JP;

Saki Fujita, Otake, JP;

Akira Harada, Toyohashi, JP;

Assignee:

Mitsubishi Chemical Corporation, Tokyo, JP;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Hannah Pak

Int. Cl.
CPC ...
C08K 7/02 (2006.01); C08J 5/06 (2006.01); D06M 13/17 (2006.01); D06M 13/224 (2006.01); D06M 15/227 (2006.01); D06M 15/263 (2006.01); D06M 15/53 (2006.01); D06M 15/564 (2006.01); C08J 5/24 (2006.01); D06M 15/59 (2006.01); D06M 15/285 (2006.01); C08J 5/04 (2006.01); C08K 7/06 (2006.01); C08K 9/04 (2006.01); B29B 15/12 (2006.01); D06M 101/40 (2006.01); C08L 23/10 (2006.01);
U.S. Cl.
CPC ...
C08J 5/06 (2013.01); B29B 15/122 (2013.01); C08J 5/042 (2013.01); C08J 5/24 (2013.01); C08K 7/06 (2013.01); C08K 9/04 (2013.01); D06M 13/17 (2013.01); D06M 13/224 (2013.01); D06M 15/227 (2013.01); D06M 15/263 (2013.01); D06M 15/285 (2013.01); D06M 15/53 (2013.01); D06M 15/564 (2013.01); D06M 15/59 (2013.01); C08J 2300/22 (2013.01); C08J 2323/00 (2013.01); C08J 2323/12 (2013.01); C08J 2377/00 (2013.01); C08J 2433/24 (2013.01); C08J 2451/06 (2013.01); C08J 2471/02 (2013.01); C08L 23/10 (2013.01); D06M 2101/40 (2013.01); D06M 2200/50 (2013.01);
Abstract

A carbon fiber bundle for resin reinforcement, wherein there are adhered by 0.1-5.0 mass % to a carbon fiber bundle in which multiple lengths of filament are bundled, a mixture created by mixing an organic polymer (A) having a mass-average molecular weight of 10000 or more and an organic compound (B) the thermal reduction rate specified in claimof which is 5 mass % or more or an organic compound (B) the thermal reduction rate specified in claimof which is 0.8 mass % or more, the amount of the organic polymer (A) adhered being 0.1 mass % or more.

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