The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2017
Filed:
Jul. 29, 2016
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventors:
Steve Canale, Simi Valley, CA (US);
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); B32B 37/10 (2006.01); B32B 38/18 (2006.01); H01L 21/768 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/673 (2006.01); B32B 38/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1009 (2013.01); B32B 38/1858 (2013.01); H01L 21/673 (2013.01); H01L 21/67092 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 21/6838 (2013.01); H01L 21/76898 (2013.01); B32B 38/0004 (2013.01); B32B 2310/0843 (2013.01); B32B 2457/14 (2013.01); H01L 22/10 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); Y10T 156/10 (2015.01); Y10T 292/45 (2015.04);
Abstract
Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.