The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Jul. 15, 2014
Applicant:

President and Fellows of Harvard College, Cambridge, MA (US);

Inventors:

Pratheev Sabaratnam Sreetharan, Cambridge, MA (US);

John Peter Whitney, Pittsburgh, PA (US);

Robert J. Wood, Cambridge, MA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); H01L 41/25 (2013.01); B25J 7/00 (2006.01); B32B 3/26 (2006.01); B32B 37/14 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); B32B 38/14 (2006.01); B81B 3/00 (2006.01); B81B 7/02 (2006.01); A63H 27/00 (2006.01); B64C 33/02 (2006.01); G02B 26/08 (2006.01);
U.S. Cl.
CPC ...
B32B 37/0076 (2013.01); A63H 27/001 (2013.01); B25J 7/00 (2013.01); B32B 3/266 (2013.01); B32B 37/144 (2013.01); B32B 37/18 (2013.01); B32B 38/0004 (2013.01); B32B 38/0012 (2013.01); B32B 38/14 (2013.01); B64C 33/02 (2013.01); B81B 3/0097 (2013.01); B81B 7/02 (2013.01); H01L 41/25 (2013.01); B32B 2038/0028 (2013.01); B32B 2307/20 (2013.01); B32B 2457/00 (2013.01); G02B 26/0833 (2013.01); Y10T 156/1064 (2015.01); Y10T 428/24331 (2015.01);
Abstract

A multi-layer, super-planar structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations.


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