The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Dec. 01, 2009
Applicants:

Chyi-ming Leu, Jhudong Township, TW;

Yueh-chuan Huang, Jhudong Township, TW;

Yung Lung Tseng, Zhubei, TW;

Inventors:

Chyi-Ming Leu, Jhudong Township, TW;

Yueh-Chuan Huang, Jhudong Township, TW;

Yung Lung Tseng, Zhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2006.01); B05D 5/12 (2006.01); B32B 27/32 (2006.01); B32B 15/08 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 3/04 (2006.01); H01L 29/786 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B32B 3/04 (2013.01); B32B 15/08 (2013.01); B32B 27/08 (2013.01); B32B 27/281 (2013.01); B32B 27/283 (2013.01); B32B 27/286 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2255/28 (2013.01); B32B 2307/748 (2013.01); B32B 2457/00 (2013.01); H01L 27/1218 (2013.01); H01L 29/78603 (2013.01); Y10T 428/24942 (2015.01);
Abstract

A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a first material layer overlying the carrier with a first area, a second material layer overlying the first material layer and the carrier with a second area, and a flexible substrate overlying the second material layer, the first material layer and the carrier with a third area, wherein the second area is larger than or equal to the first area, the third area is larger than the second area, and the flexible substrate has a greater adhesion force than that of the first material layer to the carrier. The invention also provides a method for fabricating the substrate structure.


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