The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Mar. 07, 2016
Applicant:

Hiwin Technologies Corp., Taichung, TW;

Inventors:

Chen-Ming Wong, Taichung, TW;

Shu-Hung Liu, Taichung, TW;

Assignee:

HIWIN TECHNOLOGIES CORP., Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25J 11/00 (2006.01); B25J 9/16 (2006.01);
U.S. Cl.
CPC ...
B25J 9/1692 (2013.01); G05B 2219/39024 (2013.01);
Abstract

A method of path planning for array-based pick-and-place performed with a robotic arm is characterized in that: during each instance of the pick-and-place process performed with the robotic arm, an X-axis position sensor and a Y-axis position sensor sense coordinate errors of a pick-and-place point such that a controller calculates a position compensation value according to the sum of vectors of the coordinate errors, corrects the pick-and-place position of the robotic arm according to the position compensation value, and generates the coordinates of the next pick-and-place point. By repeating the aforesaid process flow, it is feasible to perform plenty array-based pick-and-place jobs.


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