The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Sep. 14, 2015
Denso Corporation, Kariya, Aichi-pref., JP;
Tetsuto Yamagishi, Kariya, JP;
Masayuki Takenaka, Kariya, JP;
Toshihiro Nagaya, Kariya, JP;
Shinji Hiramitsu, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A manufacturing method of an electronic device, including: a circuit board with a substrate through hole; a circuit element; and a resin mold with a mold through hole, using a first mold, a second mold having a cavity, and a pressing member protruding from a bottom of the cavity includes: fixing the circuit board to the first mold; fixing the second mold to the first mold to cover an opening of the substrate through hole by the pressing member; and forming the resin mold while covering the circuit element with the constituent material in the cavity. The circuit board is deformed by press-contacting the pressing member to the circuit board in a state where a part of the pressing member is inserted into the substrate through hole so that an opening area of the substrate through hole decreases toward a reverse surface from the one surface.