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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9832871 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

Nov. 17, 2015

Module

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Nobuaki Ogawa, Kyoto, JP;

Tadashi Nomura, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO, LTD., Kyoto, JP;

Attorney:

Pearne & Gordon LLP

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 23/31 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 3/284 (2013.01); H05K 3/4007 (2013.01); H01L 23/5389 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81444 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/19106 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/068 (2013.01); H05K 2203/025 (2013.01); H05K 2203/0588 (2013.01);
Abstract

A module having high reliability in terms of its connection to an external unit is provided. The module includes: a wiring substrate that mounts components andthereon; a substrate electrode formed on one main surface of the wiring substrate; a columnar conductor connected at one end to the substrate electrode; an intermediate coating formed to cover an outer peripheral surface of the columnar conductor; and a first sealing resin layer provided to cover one main surface of the wiring substrate and the intermediate coating. The intermediate coating has a coefficient of linear expansion which is between that of the columnar conductor and that of the first sealing resin layer.

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